Measurements on pre-production wafers at Udine Presented by M. Cobal



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Measurements on pre-production wafers at Udine

  • Presented by M. Cobal

  • on behalf of the Udine group

  • Pixel Week December 2001


Measured Wafers

  • CiS



Outline

  • Tiles and diodes with guard ring

  • SC’s and MC’s yield

  • Visual inspection

    • ID marking correctness
    • visual inspection
    • mask alignment


IV measurements

  • This time, taken with 2-side chuck

  • Temperature corrections applied



Diode position



IV meas. on diode #17 (CiS)



IV meas. on diode #17 (Tesla)



Quality Control Parameters

  • Tile conformity criteria:

    • Vbd(tile)> Vop(diode)
    • Slope=I(tile @ Vop)/I(tile @ Vop-50)<2
  • Vop=max(Vdep+50,150)

  • Need to measure Vdep



Capacitance offset



CV results



CV results



Determination of Vdep and Vop

  • - Measurements lie within

  • 65 V < Vdep< 100 V

  • - Procedure specs demanded:

  • 30 V < Vdep < 120 V

  • - For all wafers: Vdep <100 V

  • Vop= max(Vdep+50,150) = 150 V



Determination of Cdep and 

  • Cdep is between 1.7-4.2 (4.5-5.6) pF for CIS (Tesla)

  • Determined as: Cdep=C(Vdep)-Coffset

  • Coffset of order of 0.2-0.7 pF (for positive polarity)

  •  lies within 2.1-3.3 kcm

  • conformity range is 2-5 kcm



Tile results (CiS)

  • Results in agreement with CIS

  • 2 wafers with 2 good tiles

  • 2 wafers with 3 good tiles

  • wafer 4456-21 with

  • Slope (Tile 1) = 3.58



SC and MC yield (CiS)

  • SC’s: 6 x 4= 24

  • 5 are bad (Vbd<150)

  • 79% are good



Tile results (Tesla)

  • Disagreement for 1 Wafer out of 4:

  • Wafer A31-12

  • Slope(Tile 2):

  • Our measure Tesla

  • 2.08 1.85



SC and MC yield (Tesla)

  • SC’s: 6 x 4=24

  • 1 is bad (Vbd<150)

  • 96% are good



Scratch pad marking (CIS)

    • 2- and 3-good-tile wafers:
    • TILES: all 4 pads marked.
    • SC’s: only 1 of the 2 pads marked (lower one).
    • All markings are correct.


Scratch pad marking (Tesla)

    • 2 and 3 good tiles wafers
    • TILES: only 2 out of 4 pads marked.
    • SC’s: only 1 of the 2 pads marked (lower one).
    • All markings are correct.


Visual Inspection (CiS)

  • 4456-21

  • n-side: Tile 2, small scratch (6 pixels)

  • #16, extended scratch (superficial)

  • 4456-23

  • n-side: Tile 1, one pixel defective

  • Tile 2, “ “

  • Tile 3, three pixels defective

  • #22, extended scratch (superficial)

  • MC13, one pixel “larger”



Visual Inspection (Tesla)

  • A31-02

  • p-side: #17, small scratch

  • #12, small scratch

  • A31-08

  • n-side: #19, extended scratch

  • p-side: bad end of the three top structures



Scratch



Mask alignment



Mask alignment (CiS)



Mask alignment (CiS)



Mask alignment (Tesla)

  • Quite bad contrast for all the vernier

  • All 3rd vernier are missing

  • All the 4th vernier are badly printed



Mask alignment (Tesla)



Database



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